尚未登入 請由此登入
 
 
 










知識分享平台Eshare檢視資訊View
返回前一頁Back
      [檢舉]

標題Title: Thermal Placement Algorithm Based on Heat Conduction Analogy
作者Authors: 黎靖
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: Physical design, reliability, thermal placement, MCM
摘要Abstract: A thermal force-directed placement algorithm, called TFPA, based on heat conduction analogy, is proposed for MCM design. TFPA begins with the transformation of the real substrate with chips into an unbounded substrate with an infinite number of chips. Then, each chip pushes every other chip with a force based on the heat conduction analogy. Thus, each chip will move in the direction of the force until the system achieves equilibrium. TFPA generates high quality placement results and maintains a cooler and uniform thermal profile, by distributing chip powers as evenly as possible. Unlike conventional force-directed algorithms, which might have serious components overlapping problems, TFPA places chips apart and only little or even no overlap occurs. In practice, the initial placements obtained by TFPA are very close to final placements.

檔案名稱
FileName
檔案大小
Size
檔案格式
Format
瀏覽次數
Browses
下載次數
Downloads
2009_11_7c605d3d.doc 478Kb doc 638 174
文件中檔案:
 

開啟檔案Download
開啟Ps檔
 
 
返回前一頁