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標題Title: A Thermal-Driven Placement Algorithm for MCM Designs
作者Authors: 黎靖
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: Physical design, reliability, thermal placement, MCM.
摘要Abstract: A thermal-force model, which is based on heat conduction analogy, is proposed for the thermal placement problem of the multichip module (MCM) designs. By using the thermal-force model, the placement problem is reduced to the problem of solving a set of simultaneous linear equations to determine equilibrium locations for chips. Four cases were studied and compared to a previous algorithm. The results show that the presented algorithm has a large improvement in system reliability.

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