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標題Title: General Thermal Force Model with Experimental Studies
作者Authors: 黎靖
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: Force-directed algorithm, reliability, thermal force, thermal placement.
摘要Abstract: Thermal force has proven to be a useful concept for managing the package-level thermal placement problem. However, the previous thermal force model is based on insulated edge boundary condition, thus it is only suitable to face-cooled packages. A general thermal force model is proposed to extend the applicability of the thermal force to cover general cooling conditions by introducing the concept of the heat transparency of a boundary, . By managing , the present method generates a series of thermal-force-equilibrium placements fitting to situations from face-cooled to edge-cooled packages. Experimental results indicate that for generating the reliability-best placements the best ’s are in the range for face-cooled packages and in the range for the volumetric-cooled packages. For edge-cooled packages, the best ’s are the largest values of that can achieve convergent thermal-force-equilibrium placements.

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2009_11_16580cf1.doc 3943Kb doc 584 171
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