尚未登入 請由此登入
 
 
 










知識分享平台Eshare檢視資訊View
返回前一頁Back
      [檢舉]

標題Title: A SIMULATED ANNEALING APPROACH TO THERMAL PLACEMENT PROBLEMS
作者Authors: 黎靖,Shin-Fa..等
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: simulated annealing, thermal placement
摘要Abstract: This paper presents a simulated annealing approach to the thermal placement problems. For speeding up the convergence of the simulated annealing, we propose a new perturbation technique that is a mix of greedy perturbation with random perturbation. Our method begins with a random initial placement. Then, a candidate placement is found by the mixed perturbation. The candidate is accepted or rejected based on its system failure rate. A heat transfer solver is used to determine the temperature distributions on the placement substrate and to calculate the system failure rate of the placement. Three industry circuits designed by IBM are used to examine the present method and compare to an existed placement algorithm.

檔案名稱
FileName
檔案大小
Size
檔案格式
Format
瀏覽次數
Browses
下載次數
Downloads
2009_11_a82f4fce.doc 159Kb doc 639 155
文件中檔案:
 

開啟檔案Download
開啟Ps檔
 
 
返回前一頁