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標題Title: Multiobjective Optimal Placement for MCM Designs
作者Authors: 黎靖
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: Placement, reliability, wireability, MCM.
摘要Abstract: This paper proposes a coupled reliability and wireability placement procedure for the MCM designs. The placement procedure is broken into two phases, Phase I being the “zero-force placement,” and Phase II being the “chip assignment.” In Phase I, a system of simultaneous equations, based on a combination of the traditional interconnection force model and a novel thermal force model, are solved to determine the optimum relative locations of chips. In Phase II, chips are assigned into chip sites in order to distort the chips positions obtained by Phase I as little as possible. Two benchmarks, MCC1 and MCC2, have been examined by the present methodology.

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