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標題Title: Reliability and Wireability Optimizations for Chip Placement on Multichip Modules
作者Authors: 黎靖
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: Force-directed algorithm, MCM, Placement, Thermal force.
摘要Abstract: The chip placement problem of MCM designs is to map the chips properly to the chip sites on the MCM substrate. Chip placement, affects not only the thermal characteristics of an MCM but also routing efficiency, which translates directly into manufacturability, performance, and cost. This paper presents a solution methodology for the optimal placement problem considering both thermal and routing design objectives simultaneously. The coupling is achieved through use of a hybrid-force model that is a combination of the traditional interconnection-force model and a novel thermal-force model. The placement procedure can be used as a design tool to place chips and then determine the tradeoffs which can be made in placing for reliability and wireability. Experiments on five examples including three benchmarks show that the present algorithm yields very high quality results.

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2009_11_9178740a.doc 1593Kb doc 525 145
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