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標題Title: RELIABILITY PREDICTION
作者Authors: 黎靖
上傳單位Department: 電子工程系
上傳時間Date: 2009-11-20
上傳者Author: 黎靖
審核單位Department: 電子工程系
審核老師Teacher: 黎靖
檔案類型Categories: 論文Thesis
關鍵詞Keyword: Reliability prediction
摘要Abstract: Reliability prediction is the statistical art of determining a value of time over which a device will function. It is closely related to thermal performance, and the primary failure mode in electronics is thermal induced. In this section the MIL-HDBK-217 is introduced, which establishes uniform methods for predicting the reliability of electronic equipment and systems. The MIL-HDBK-217 procedure provide models for both a parts-count analysis and for a stress analysis. The parts-count model assumes typical operating parameters for a component and is used when most of its operating parameters are unknown. The stress model requires a detailed analysis of all of the parameters on which the component failure-rate depends.

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2009_11_fe15185c.pdf 54Kb pdf 628 380
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