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標題Title: 微細放電加工期末報告
作者Authors: 黃宗偉
上傳單位Department: 機械工程系
上傳時間Date: 2015-6-22
上傳者Author: 黃宗偉
審核單位Department: 機械工程系
審核老師Teacher: 戴子堯
檔案類型Categories: 課堂報告In-class Report
關鍵詞Keyword: recast layer
摘要Abstract: Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (Ra = 1.85 nm) was obtained.

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2015_6_4466e5d1.pptx 5645Kb pptx 70 24
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