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標題Title: The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction
作者Authors: 楊顯奕,D.Q. Yua..等
上傳單位Department: 機械工程系
上傳時間Date: 2011-5-25
上傳者Author: 楊顯奕
審核單位Department: 機械工程系
審核老師Teacher: 林克默
檔案類型Categories: 課堂報告In-class Report
關鍵詞Keyword: Lead free solder; Intermetallic compounds; Ag3Sn; Wetting reaction.
摘要Abstract: The morphologies of the intermetallic compounds (IMC) forming during wetting reaction between molten Sn–3.5Ag, Sn–3.5Ag–0.7Cu
lead free solder alloys and pure Cu and Ni substrate were investigated. It is quite interesting that nano-size Ag3Sn particles were found on the
IMC surface. It seems that the formation of Ag3Sn particles takes place in the solidification process. The existence of these particles would
decrease the interfacial energy and hamper the growth of the IMC layer. Adsorption theory is used to explain the formation of these particles
and their effect on the surface energy of the IMC.

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2011_5_ea5d17f9.ppt 6712Kb ppt 427 109
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